本文針對大直徑硅片的高速自動化生產(chǎn)對硅片的高效、高精度、高可靠性傳輸要求，確定基于3 自由度的R-θ型硅片傳輸定位機器人方案，設(shè)計了大直徑硅片傳輸定位機器人系統(tǒng)。在設(shè)計過程中，通過采用基于絲杠花鍵軸的升降旋轉(zhuǎn)機構(gòu)、采用周轉(zhuǎn)輪系傳遞臂體的伸縮動力等措施，解決了現(xiàn)有同類傳輸機器人系統(tǒng)中存在的剛性低、結(jié)構(gòu)復(fù)雜等問題。此外，本文通過運動學(xué)分析證明了徑向伸縮部件的直線運動軌跡；利用拉格朗日的分析力學(xué)的方法對該部件的模型進行了動力學(xué)分析，得出動力矩方程。調(diào)試結(jié)果表明，該機器人的徑向伸縮運動的直線精度達到了使用要求。
關(guān)鍵詞: 硅片傳輸機器人；機構(gòu)；運動學(xué)分析；動力學(xué)分析

Abstract: To satisfy the high efficiency, high precision and high reliability requirement
of transfering and positioning the large-diameter silicon slices in high speed wafer
manufacturing , the R-θtype wafer robot based on 3 DOF is adopted, and the wafer robot is
designed. In the design, the rolling ball screw & the ball spline pair are used as actuating
mechanism in the up-down rotary component. The epicyclic gear train is adopted to drive
the arm to move along line. The new design improves the rigidity of structure of the system
and simplify the mechanism. Furthermore,the kinematic of the linear mechanism of radial
stretch component is analyzed to prove its moving track which moves along line. The model
of the componet is analyzed with Largrange method to achieve the equation of drive torque.
The testing shows that the line accuracy of radial linear stretch component satisfy the
parctical requirement.
Keywords:Wafer robot；Mechanism；Kinematics analysis；Dynamic analysis