負(fù)空間應(yīng)用設(shè)計(jì)：PC板電源設(shè)計(jì)的數(shù)字控制技術(shù)

　　越來(lái)越多的處理到網(wǎng)絡(luò)和計(jì)算設(shè)備的印刷電路板（PCB）始終是一個(gè)“處理能力與權(quán)力”悖論。較新的集成電路（IC）的設(shè)計(jì)包多次處理能力在同一空間超過(guò)上一代設(shè)備。這種增加的能力使高性能的產(chǎn)品，如一個(gè)軟件定義的網(wǎng)絡(luò)（SDN）開(kāi)關(guān)與額外的開(kāi)關(guān)能力或自動(dòng)化測(cè)試設(shè)備（ATE）設(shè)備具有更快的吞吐量。然而，更高的處理能力也可能意味著更高的功率要求，與IC和電源模塊使用更多的PCB房地產(chǎn)

　　How can designers recover board space lost to rising power requirements fueled by the need for increased processing capability？ At GE we look at solutions to these challenges with a principle we call Designing in the Negative Space.

　　Designing in the Negative Space （DITNS） looks at a number of engineering approaches to reduce the power module “footprint” on a printed circuit board. For example， making power modules denser while reducing their height enables designers to place them in previously unusable spaces. We see this approach used with GE’s low-height SlimLynx? family of point-of-load （POL）， or DC/DC converter， power modules that fit under a mezzanine board， or that can be placed on the back of the board， freeing up top-of-board space for taller components. （See Figure 1）