高密度封裝技術(shù)推動(dòng)測(cè)試技術(shù)發(fā)展
鮮 飛（烽火通信科技股份有限公司,湖北 武漢 430074）
摘要：高密度封裝技術(shù)的飛速發(fā)展也給測(cè)試技術(shù)提出了新挑戰(zhàn)。為了應(yīng)對(duì)挑戰(zhàn)，新的測(cè)試技術(shù)不斷涌現(xiàn)。本文主要介紹了幾種新型測(cè)試技術(shù)的特點(diǎn)，并對(duì)未來測(cè)試技術(shù)的發(fā)展趨勢(shì)及方向進(jìn)行了初步分析。
關(guān)鍵詞：集成電路；封裝；測(cè)試技術(shù)；自動(dòng)光學(xué)檢測(cè)技術(shù)；自動(dòng)X-射線檢測(cè)
Testing Technology Development Promoted by HDI Packaging Technology
XIAN Fei（Fiberhome Telecommunication Technologies Co.,Ltd, Wuhan 430074,China）
Abstract: The rapid development of high density packaging technology has already bring up the ew challenge to testing technology. For replying challenge, the new testing technology
continuously appears. Characteristics of several advanced testing technology are introduced in the
paper. The up-to-date trends are discussed and the future research directions are suggested.
Key words: IC; Package; Testing Technology; AOI; AXI